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NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
Rev. 03 -- 5 August 2009 Product data sheet
1. General description
The NX5DV330 is a quad 1-of-2 high-speed TTL-compatible video multiplexer/demultiplexer. The low ON resistance of the switch allows inputs to be connected to outputs without adding propagation delay or generating additional ground bounce noise It has a digital select input (S), four independent inputs/outputs (nY0, nY1), a common input/output (nZ) and an active LOW enable input (E). When pin E is HIGH, the switch is turned off. Schmitt-trigger action at the enable input (E) and select input (S) makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 4.0 V to 5.5 V. The NX5DV330 is characterized for operation from -40 C to +85 C.
2. Features
5 switch connection between two ports TTL-compatible input levels Minimal propagation delay through the switch ESD protection: N HBM JESD22-A114E Class 2A exceeds 2000 V N MM JESD22-A115-A exceeds 200 V N CDM JESD22-C101C exceeds 1000 V I Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA I I I I
NXP Semiconductors
NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
3. Ordering information
Table 1. Ordering information Package Temperature range Name NX5DV330D NX5DV330DS NX5DV330PW NX5DV330BQ -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +85 C SO16 SSOP16[1] TSSOP16 Description plastic small outline package; 16 leads; body width 3.9 mm plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm Version SOT109-1 SOT519-1 SOT403-1 SOT763-1 Type number
DHVQFN16 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 x 3.5 x 0.85 mm
[1]
Also known as QSOP16.
4. Functional diagram
4 2
1Z
1Y0
3
1Y1
2Z
7
5
2Y0
6
2Y1
3Z
9
11
3Y0
10
3Y1
4Z
12
14
4Y0
13
4Y1
S
1
E
15
001aai498
Fig 1.
Logic diagram
NX5DV330_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 5 August 2009
2 of 15
NXP Semiconductors
NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
5. Pinning information
5.1 Pinning
NX5DV330
S 1Y0 1Y1 1Z 2Y0 2Y1 2Z GND 1 2 3 4 5 6 7 8
001aai499
16 VCC 15 E 14 4Y0 13 4Y1 12 4Z 11 3Y0 10 3Y1 9 3Z S 1Y0 1Y1 1Z 2Y0 2Y1 2Z GND 1 2 3 4 5 6 7 8
001aai500
NX5DV330
16 VCC 15 E 14 4Y0 13 4Y1 12 4Z 11 3Y0 10 3Y1 9 3Z
Fig 2.
Pin configuration for SOT109-1 (SO16)
Fig 3.
Pin configuration for SOT519-1 (SSOP16)
NX5DV330
terminal 1 index area 16 VCC 15 E 14 4Y0 13 4Y1 12 4Z GND(1) 8 9 3Z 11 3Y0 10 3Y1 GND S 2 3 4 5 6 7 1 1Y0 16 VCC 15 E 14 4Y0 13 4Y1 12 4Z 11 3Y0 10 3Y1 9
001aai501
NX5DV330
S 1Y0 1Y1 1Z 2Y0 2Y1 2Z GND 1 2 3 4 5 6 7 8
1Y1 1Z 2Y0 2Y1 2Z
3Z
001aak330
Transparent top view
Fig 4.
Pin configuration for SOT403-1 (TSSOP16)
Fig 5.
Pin configuration for SOT763-1 (DHVQFN16)
5.2 Pin description
Table 2. Symbol S 1Z, 2Z, 3Z, 4Z GND E VCC
NX5DV330_3
Pin description Pin 1 4, 7, 9, 12 8 15 16 Description select control input independent input or output independent input or output ground (0 V) enable input (active LOW) positive supply voltage
(c) NXP B.V. 2009. All rights reserved.
1Y0, 1Y1, 2Y0, 2Y1, 3Y1, 3Y0, 4Y1, 4Y0 2, 3, 5, 6, 10, 11, 13, 14
Product data sheet
Rev. 03 -- 5 August 2009
3 of 15
NXP Semiconductors
NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
6. Functional description
Table 3. Function selection H = HIGH voltage level; L = LOW voltage level; X = Don't care. Input E L L H S L H X Y0 to Z or Z to Y0 Y1 to Z or Z to Y1 switch off Switch
7. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VI ISW IIK Tstg Ptot
[1] [2] [3] [4]
Parameter supply voltage input voltage switch current input clamping current storage temperature total power dissipation
Conditions
[1]
Min -0.5 -0.5 -65
[2][3][4]
Max +7.0 +7.0 128 -50 +150 500
Unit V V mA mA C mW
continuous current through each switch VI < 0 V
-
The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. For SO16 package: Ptot derates linearly with 8 mW/K above 70 C. For SSOP16 (QSOP16) and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 C. For DHVQFN16 packages: above 60 C derate linearly with 4.5 mW/K.
8. Recommended operating conditions
Table 5. Operating conditions All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Symbol VCC VIH VIL VH Tamb Parameter supply voltage HIGH-level input voltage LOW-level input voltage hysteresis voltage ambient temperature pin S, E operating in free-air Conditions Min 4.0 2.0 -40 Typ 5.0 45 +25 Max 5.5 0.8 +85 Unit V V V mV C
NX5DV330_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 5 August 2009
4 of 15
NXP Semiconductors
NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
9. Static characteristics
Table 6. Static characteristics Tamb = -40 C to +85 C. Symbol VIK II IS(OFF) IOFF ICC ICC CI Cio(off) Cio(on) RON Parameter input clamping voltage input leakage current OFF-state leakage current power-off leakage current supply current additional supply current input capacitance off-state input/output capacitance on-state input/output capacitance ON resistance Conditions VCC = 4.5 V; II = -18 mA pin S, E; VCC = 5.5 V; VI = GND or 5.5 V VCC = 5.5 V; VI = GND; VO = 0 V to 5.5 V VCC = 0 V; VI = VO = 0 V to 5.5 V VCC = 5.5 V; IO = 0 mA; VI = VCC or GND pin S, E; VCC = 5.5 V; one input at 3.4 V, other inputs at VCC or GND pin S, E; VI = 5 V or 0 V Z port; VCC = 5 V; VO = 5 V or 0 V; E = VCC Y port; VCC = 5 V; VO = 5 V or 0 V; E = VCC Z port; VCC = 5 V; VO = 5 V or 0 V; E = GND VCC = 4.5 V VI = 1.0 V; II = 13 mA VI = 2.0 V; II = 26 mA
[1] [2] [3] All typical values are measured at VCC = 5 V; Tamb = 25 C. This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. Measured by the voltage drop between the Z and the Y terminals at the indicated current through the switch. ON-state resistance is determined by the lowest voltage of the two (Z or Y) terminals.
[3] [2]
Min -
Typ[1] 3.5 6.0 4.0 14
Max -1.2 1 1 1 3 2.5 -
Unit V A A A A mA pF pF pF pF
-
3 7
7 10

10. Dynamic characteristics
Table 7. Dynamic characteristics Tamb = -40 C to +85 C; for test circuit see Figure 7. Symbol ton toff Parameter turn-on time turn-off time Conditions S to nZ; see Figure 6 VCC = 4.5 V to 5.5 V S to nZ; see Figure 6 VCC = 4.5 V to 5.5 V 2.3 6.0 ns 4.0 6.0 ns Min Typ Max Unit
NX5DV330_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 5 August 2009
5 of 15
NXP Semiconductors
NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
11. Waveforms
VI S input GND VM VM
ton
VOH nZ output GND VY
toff
VY
001aai502
Measurement points are given in Table 8. VOH is the typical voltage output level that occurs with the output load.
Fig 6. Table 8. VCC
Input (S) to output (nZ) turn-on and turn-off time Measurement points Input VI GND to 3.0 V VM 1.5 V Output VY 0.9VOH
Supply voltage 4.5 V to 5.5 V
VCC
S Z E G
Vi 50
Y0 Y1
VY0 VY1
V
VO
RL
CL
GND
001aai503
Test data is given in Table 9. Definitions test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance.
Fig 7. Table 9. Input VI
Test circuit for measuring turn-on and turn-off times Test data Load fi 10 MHz tr, tf 2.5 ns VY0 GND to 3.0 V VY1 3.0 V to GND RL 75 CL 20 pF
GND to 3.0 V
NX5DV330_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 5 August 2009
6 of 15
NXP Semiconductors
NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
12. Additional dynamic characteristics
Table 10. Additional dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); VI = GND or VCC (unless otherwise specified); Tamb = 25 C; VCC = 4.5 V to 5.5 V. Symbol Parameter Gdif dif f(-3dB) iso Xtalk differential gain differential phase -3 dB frequency response isolation (OFF-state) crosstalk Conditions fi = 3.58 MHz; RL = 150 fi = 3.58 MHz; RL = 150 RL = 150 ; see Figure 8 fi = 10 MHz; RL = 150 ; see Figure 9 between switches; see Figure 10; fi = 10 MHz; RL = 150 ; Ri = 10
[1]
Min 300 -
Typ 0.64 0.1 -60 -63
Max -
Unit % deg MHz dB dB
[1]
All unused analog input pins (nZ) and outputs pins (nYn) are connected through 10 and 50 pull-down resistors, respectively.
13. Test circuits
VCC S Y0 1 switch Z Y1 2 switch 1 2 S VIL VIH
VIL or VIH
fi
RL
dB
GND
001aai505
Adjust fi voltage to obtain 0 dBm level at output. Increase fi frequency until dB meter reads -3 dB.
Fig 8.
Test circuit for measuring the frequency response when channel is in ON-state
VCC S Y0 1 switch Z Y1 2 switch 1 2 S VIH VIL
VIL or VIH
fi
RL
RL
dB
GND
001aai506
Adjust fi voltage to obtain 0 dBm level at input.
Fig 9.
Test circuit for measuring isolation (OFF-state)
NX5DV330_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 5 August 2009
7 of 15
NXP Semiconductors
NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
VIH or VIL
1E 1Z 1Y
fi
RL
50
2Z
2Y
Ri
RL
dB
001aai507
Adjust fi voltage to obtain 0 dBm level at input.
Fig 10. Test circuit for measuring crosstalk voltage between digital inputs and switch
NX5DV330_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 5 August 2009
8 of 15
NXP Semiconductors
NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
14. Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 pin 1 index Lp 1 e bp 8 wM L detail X A1 (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
0.028 0.004 0.012
8 o 0
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 11. Package outline SOT109-1 (SO16)
NX5DV330_3 (c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 5 August 2009
9 of 15
NXP Semiconductors
NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm
SOT519-1
D
E
A X
c y HE vM A
Z 16 9
A2 A1 (A 3) Lp L 1 e bp 8 wM detail X
A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.73 A1 0.25 0.10 A2 1.55 1.40 A3 0.25 bp 0.31 0.20 c 0.25 0.18 D (1) 5.0 4.8 E (1) 4.0 3.8 e 0.635 HE 6.2 5.8 L 1 Lp 0.89 0.41 v 0.2 w 0.18 y 0.09 Z (1) 0.18 0.05 8o o 0
Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT519-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 99-05-04 03-02-18
Fig 12. Package outline SOT519-1 (SSOP16)
NX5DV330_3 (c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 5 August 2009
10 of 15
NXP Semiconductors
NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c y HE vMA
Z
16
9
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
8
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 o 0
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18
Fig 13. Package outline SOT403-1 (TSSOP16)
NX5DV330_3 (c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 5 August 2009
11 of 15
NXP Semiconductors
NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT763-1 16 terminals; body 2.5 x 3.5 x 0.85 mm
D
B
A
A A1 E c
terminal 1 index area
detail X
terminal 1 index area e 2 L
e1 b 7 vMCAB wM C y1 C
C y
1 Eh 16
8 e 9
15 Dh
10 X 2.5 scale 5 mm
0
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 3.6 3.4 Dh 2.15 1.85 E (1) 2.6 2.4 Eh 1.15 0.85 e 0.5 e1 2.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT763-1 REFERENCES IEC --JEDEC MO-241 JEITA --EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27
Fig 14. Package outline SOT763-1 (DHVQFN16)
NX5DV330_3 (c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 5 August 2009
12 of 15
NXP Semiconductors
NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
15. Abbreviations
Table 11. Acronym CDM ESD HBM MM TTL Abbreviations Description Charged Device Model ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic
16. Revision history
Table 12. Revision history Release date 20090805 Data sheet status Product data sheet Product data sheet Product data sheet Change notice Supersedes NX5DV330_2 NX5DV330_1 Document ID NX5DV330_3 Modifications: NX5DV330_2 NX5DV330_1
*
Added type number NX5DV330BQ (DHVQFN16 package)
20080825 20080815
NX5DV330_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 5 August 2009
13 of 15
NXP Semiconductors
NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
17. Legal information
17.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
17.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
NX5DV330_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 5 August 2009
14 of 15
NXP Semiconductors
NX5DV330
Quad 1-of-2 video multiplexer/demultiplexer
19. Contents
1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Additional dynamic characteristics . . . . . . . . . 7 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 5 August 2009 Document identifier: NX5DV330_3

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